CoolWhip Air Peltier upgrade for PIII can
only be mounted on a CoolWhip Air heat sink. When you receive it, the
package should contain the following parts:
- 1 pcs. Back plate with insulation
- 1 pcs. Peltier with outlets for Fans
- 1 pcs. PIII Cool plate with 4 holes and L2-Cache pads
- 3 pcs. Insulation gaskets
- 1 pcs. Double adhesive foam tape
- 4 pcs. Nylon-screws
- 4 pcs. Nylon-hex nuts
- 1 heat sink compound (may already be applied on the products) |
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Here you have the original Intel Pentium III
processor with the retail Cooler mounted. It needs to go off first!
In order to remove the original cooler it is necessary first to remove
the plastic-cover with the fan. This is best done by pressing on the
clamping "legs" which holds the cover in place and lifting the
cover up at the same time. When you have it raised app. an inch at one
end, you can drag it sideways, so it slips off at the other end too. |
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Now you are ready to take off the heat sink
itself, and this is best done by extracting the small plastic-splits
with a suitable tool (as shown on the picture, we have good experience
using a PC spare slot cover sitting coercing the holes in unused PCI/ISA
plug-in card slots)
If you don't want to make any marks in the original heat sink, you could
place a cloth underneath the tool towards the heat sink first.
A swift and firm tip, and the splits will come up with a
"squeaking" sound (this is the way it should sound if you do
it right)
A method we have actually also seen on OverClocking.dk |
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The heat sink itself will now either fall off
by itself, or you can twist it off by turning right and left around.
Here you have the parts taken apart: Pentium III, plastic-splits and heat sink.
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Finally you need to take off the original
Rear Cover.
You can choose to either squeeze the small locking clips holding the PCB
in place on the rear cover, to allow you to take the two items apart, or
simply just cut them off, so the Rear Cover plate falls off by itself. |
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| Now you need to mount the thermal transfer
pad on the processor, and for that you use the "self-adhesive"
thermal GAP pad. Peal off the protecting foil on one side of the pad
material, and place it in the area around the "slug" on the
processor, as shown on the picture. Remember to start at the edge of the
"slug" not the edge of the processor, this way you avoid
having to fit a piece in between the previously mounted pieces
(The best position of a possible temperature
probe is on the rear of the PIII PCB)
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Cut the Gap pad at the edge, and continue all
the way round the "slug"
Pay attention not to have any gap between the individual pieces. |
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| Cut off excessive padding material, and you
are ready to proceed to the next step. |
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Peal off the plastic foil covering the heat sink
compound on the Peltier element, and distribute it all over the surface
in a very thin layer on the Peltier-element. Remember to "sweep"
off all compound from the heat sink, that was sitting there from when
you used the heat sink directly on the processor.
Since the heat sink and the Peltier element are completely plane, it
only requires a very very small amount of compound, otherwise the
thermal contact is reduced rather than enhanced. |
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Now press the Peltier element towards the
surface of the heat sink, and slide it sideways or twist it slightly
clock and counter-clockwise, while pressing firmly.
By sliding it apart you can check if you have full thermal contact
between the two. If you find areas without compound distribute it
somewhat better, from the other areas.
Continue this process till full thermal contact is obtained. |
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| Now pick up one of the screws, and put it
through the cool plate and insulation, shift it back and forth or up and
down a little, until you find the screw hole down in the heat sink.
Repeat this procedure diagonally across, assuring that it is all firmly aligned
with each other. |
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| Now you are ready to mount the processor on
the Cool plate.
First as usual peal off the plastic foil,
from the Cool plate and the small thermal Gap Pad's which are to give
contact to the L2 Cache-chips.
If as shown on the picture to the right, there are half a ton of heat sink
compound, wipe off most of it, and spread it out on the Processor to
fill up all gaps there, as only a very small amount is needed on the slug
itself.
Place the last super-soft insulation gasket (the one with the cut-outs
for the Processor and the L2 RAM's) on top of the Cool plate and place
the Pentium III PCB on top with the processor towards the cool plate, so
that the L2 Cache chips fits over the 2 small thermal pads, and press it
firmly towards the Cool Plate.
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| Make sure once again, that all the holes
still line up all way down to the heat sink, by putting the screws into
each hole, verifying that it grabs into the thred. |
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| Press the PCB firmly down, to insure proper
thermal contact between all layers. |
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| Now take the insulated Rear plate, and place
it with the insulation towards the PCB, and the soft spot over the L2
controller chip on the rear of the PCB. |
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Screw a hex-nuts on each screw all the way up
to the screw head, and put each screw all the way through the rear plate,
insulation, PCB, Cool plate, more insulation and into the screw holes on
the heat sink. (yes, there is quite a way to go)
It can be teasing, but be patient and you will eventually get it right.
Now screw the screws until you feel a natural resistance, and the screw
holds in place.
NOTE! you are still not finished yet!!! If you
finish off here, you will most likely destroy both the Peltier and the
processor. |
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| Finally you must tighten the back plate by
turning each hex-nut clock-wise towards the back plate, so the pressure
increases. Turn equally on each hex-nut one turn at a time. If you can
still press with your finger on top, so the individual parts move
closer, you have still not got it properly in place. But don't tighten
it so much that the threds on the screws or the hex-nuts are destroyed.
(A smaller wrench than the one shown here,
could also be used.)
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| It should end up looking like this! |
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